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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Return shipping will be paid by: Buyer
  • All returns accepted: Returns Accepted
  • Type: Reballing Stencil
  • Restocking Fee: No
  • is_customized: No
  • Item must be returned within: 30 Days
  • Model Number: BGA Direct Heating Reballing Stenci
  • application: Samsung HUAWEI HTC MTK Android
  • Condition: New
  • MPN: Does not apply
  • Refund will be given as: Money Back
  • Usage: Home DIY
  • Material: Cast Iron
  • Brand: Unbranded

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.