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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Brand: Unbranded
  • Item must be returned within: 30 Days
  • Usage: Home DIY
  • MPN: Does not apply
  • Condition: New
  • application: Samsung HUAWEI HTC MTK Android
  • All returns accepted: Returns Accepted
  • Model Number: BGA Direct Heating Reballing Stenci
  • is_customized: No
  • Return shipping will be paid by: Buyer
  • Material: Cast Iron
  • Restocking Fee: No
  • Type: Reballing Stencil
  • Refund will be given as: Money Back

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.